XiC Products

XiC Corp. is a technology company specializing in developing and manufacturing advanced XiC™ crystal-based heating, vacuum, and bonding tools and components for use in semiconductor packaging, chip bonding, and related precision applications.

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Pulse Heater [Rapid Heater Element]

  • Overview: High-speed heating element used in semiconductor chip packaging and TC bonding
  • Heating Element: XiC Direct heating
  • Spec: To be announced
  • Application: Flip Chip Bonding, HBM (TSV) Bonding, ACF Bonding
  • XiC Technology (patents): 3 fields, 8 items

Heater Vacuum Plate [P&P Bonding Tool]

  • Overview: Pick & Place bonding tool for vacuum adsorption of semiconductor chips (Also a consumable part paired with the Pulse Heater)
  • Material &: XiC & Static Dissipative / Antistatic
  • Spec: Hardness: 3000 Hv, Thermal conductivity: 310–460 W/m·K, Sheet resistance: 1E6–1E9 Ω
  • Application: Flip Chip Bonding, HBM (TSV) Bonding
  • XiC Technology (patents): 2 fields, 5 items

Coining Head [Bump Flatten Tool]

  • Overview: Tool for pressure-flattening bumps on chip substrates
  • Material &: XiC & Surface Enhancement
  • Spec: Hardness: 3000 Hv, Compression strength: 52 GPa, Flatness: 1 µm / 90 mm², Surface roughness: Ra ≤ 1 nm
  • Application: Flip Chip Bonding, HBM (TSV) Bonding
  • XiC Technology (patents): 2 fields, 4 items

XiC™ Crystal Application

  • Overview: Various application products using XiC Crystal
  • Examples: Nozzle, Pin, Disk
  • Material &: XiC &
  • Spec: Depends on application
  • XiC Technology (patents): In progress

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sales@landmarkmeasurement.com

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